The **ATS-20F-160-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or component failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Type** | Top Mount Heat Sink | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 6.67°C/W (at 100 LFM) | | **Fin Pattern** | Fine Pitch (Rectangular) | --- ### 2. Key Component Features #### A. Fin Design The "F" in the part number indicates a **Fine-Pitch** fin geometry. This design increases the total surface area available for heat transfer, making it highly effective in environments with forced-air cooling (fans). #### B. Push-Pin Attachment Unlike adhesive-based heat sinks, the **pushPIN™** system uses a spring-loaded mechanism. This ensures: * **Constant Pressure:** Optimizes the interface between the heat sink and the chip. * **Secure Mounting:** Highly resistant to shock and vibration. * **Ease of Assembly:** Can be installed quickly using pre-drilled holes on the PCB. #### C. Material and Finish * **Aluminum 6063:** Provides a balance of high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Protects the aluminum from corrosion and slightly increases emissivity, improving radiant heat transfer. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 6.67 | | **300 LFM (1.5 m/s)** | 2.80 | | **500 LFM (2.5 m/s)** | 2.10 | --- ### 4. Typical Applications This part is commonly found in: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **CPUs/GPUs:** Small form-factor processors or localized hot spots.