The **ATS-20F-164-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Heat Sink Type** | Blue Anodized Aluminum | | **Fin Configuration** | Fine Pitch (High efficiency) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 25mm | | **Thermal Resistance** | ~2.41°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Features and Electronic Function #### 1. Heat Dissipation Mechanism In electronics, excessive heat leads to signal degradation and hardware failure. The ATS-20F-164-C2-R0 acts as a passive cooling system that increases the surface area of the heat-generating component, allowing air to carry away the thermal energy more efficiently. #### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **push-pin and spring** assembly. * **Reliability:** It ensures a constant, uniform pressure on the electronic package (BGA, FPGA, or CPU). * **Ease of Assembly:** It can be quickly installed into pre-drilled holes on the PCB (Printed Circuit Board). #### 3. Material and Coating The part is made of **Aluminum 6063**, which offers high thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it provides: * Increased corrosion resistance. * Enhanced surface emissivity (minor improvement in radiation cooling). * Electrical insulation of the heat sink surface. #### 4. Thermal Interface Material (TIM) The base is pre-coated with **T766**, a high-performance phase-change material. This fills the microscopic air gaps between the electronic component's top surface and the heat sink base, significantly reducing thermal resistance at the contact point. --- ### Application Scenarios This specific heat sink is commonly found in: * **Networking Gear:** Switches and Routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and high-speed processors.