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  • ATS-20F-166-C1-R0

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    The part number **ATS-20F-166-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 12.15 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 15.0mm | | **Fin Style** | XCUT (Cross-Cut) | --- ### 2. Breakdown of the Part Number The part number is a coded string that defines the specific configuration: - **ATS-20**: Refers to the product family (Advanced Thermal Solutions). - **F**: Indicates the fin density/type. - **166**: Specific size and height configuration (25x25x15mm). - **C1**: Denotes the material and thermal interface material (TIM). In this case, it usually implies a high-performance blue anodized finish. - **R0**: Revision code or packaging indicator. --- ### 3. Key Electronic Functions While a heat sink is a mechanical part, its role in an electronic circuit is critical for **Thermal Management**: 1. **Heat Dissipation:** It increases the surface area of a semiconductor device, allowing the air to carry away heat generated by electrical resistance. 2. **Thermal Interface:** The flat base is designed to be paired with a Thermal Interface Material (TIM) like thermal paste or pads to eliminate air gaps between the chip and the metal. 3. **Mechanical Stability:** The "Push-Pin" system ensures consistent pressure across the chip, which prevents the heat sink from shifting during vibration or shipping, protecting the delicate silicon underneath. ### 4. Application Use Cases - **Power Management:** Cooling voltage regulators or power MOSFETs. - **Embedded Systems:** Cooling small-form-factor processors in industrial PCs. - **Networking:** Applied to high-speed switch chips or routers. ---
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for the push-pin mounting on this heat sink?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied material?
    • ⤷ How does the 'XCUT' fin design compare to straight fins in terms of airflow?