ATS-20F-166-C1-R0
AI

The part number **ATS-20F-166-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 12.15 °C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 15.0mm |
| **Fin Style** | XCUT (Cross-Cut) |
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### 2. Breakdown of the Part Number
The part number is a coded string that defines the specific configuration:
- **ATS-20**: Refers to the product family (Advanced Thermal Solutions).
- **F**: Indicates the fin density/type.
- **166**: Specific size and height configuration (25x25x15mm).
- **C1**: Denotes the material and thermal interface material (TIM). In this case, it usually implies a high-performance blue anodized finish.
- **R0**: Revision code or packaging indicator.
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### 3. Key Electronic Functions
While a heat sink is a mechanical part, its role in an electronic circuit is critical for **Thermal Management**:
1. **Heat Dissipation:** It increases the surface area of a semiconductor device, allowing the air to carry away heat generated by electrical resistance.
2. **Thermal Interface:** The flat base is designed to be paired with a Thermal Interface Material (TIM) like thermal paste or pads to eliminate air gaps between the chip and the metal.
3. **Mechanical Stability:** The "Push-Pin" system ensures consistent pressure across the chip, which prevents the heat sink from shifting during vibration or shipping, protecting the delicate silicon underneath.
### 4. Application Use Cases
- **Power Management:** Cooling voltage regulators or power MOSFETs.
- **Embedded Systems:** Cooling small-form-factor processors in industrial PCs.
- **Networking:** Applied to high-speed switch chips or routers.
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- ⤷
What is the hole pattern requirement for the push-pin mounting on this heat sink?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied material?
- ⤷ How does the 'XCUT' fin design compare to straight fins in terms of airflow?