The **ATS-20F-17-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, typically used for cooling integrated circuits (ICs), BGAs, and other surface-mount components. It is manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Component Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Category** | Thermal Management (Heat Sinks) | | **Fin Type** | Cross-Cut (Grid) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~15.44°C/W (at 100 LFM) | --- ### 2. Physical Dimensions Precision is critical for board layout to ensure the heat sink does not interfere with surrounding components. * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height:** 12.70 mm * **Hole Pattern:** Variable based on push-pin spacing. --- ### 3. Key Electronic/Thermal Features #### A. Cross-Cut Fin Design Unlike straight-fin heat sinks, the cross-cut (or pin-fin) design allows for **multi-directional airflow**. This is crucial in compact electronic enclosures where airflow might not be perfectly linear. #### B. Material and Coating * **Aluminum 6063:** Provides a balance of high thermal conductivity and lightweight properties. * **Blue Anodizing:** Besides the aesthetic look, the anodized layer increases surface emissivity (improving radiation heat transfer) and provides corrosion resistance. #### C. Push-Pin Attachment (R0) The "R0" suffix denotes the attachment mechanism. * Uses a **plastic push-pin** with a **brass/steel spring**. * Requires pre-drilled holes in the PCB. * Ensures consistent pressure (interface pressure) between the heat sink and the chip for optimal heat transfer via the Thermal Interface Material (TIM). --- ### 4. Typical Applications This specific size (35mm x 35mm) is commonly found on: * Network Switches and Routers. * Embedded computing modules. * Power supplies and DC-DC converters. * Field Programmable Gate Arrays (FPGAs). ---