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  • ATS-20F-176-C2-R0

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    The **ATS-20F-176-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 2.50°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height** | 25.00mm | | **Fin Style** | Tapered (High Performance) | --- ### 2. Key Electronic Features #### A. Thermal Management Design The heat sink utilizes a **tapered fin design**, which increases the surface area for heat dissipation while reducing pressure drop. This allows for maximum airflow through the fin field, making it ideal for high-density electronic assemblies. #### B. pushPIN™ Attachment System Instead of simple adhesive tape, this model uses a **pushPIN™** mechanism. This is critical for electronics because: * It ensures a **consistent pressure** across the component, improving thermal interface material (TIM) performance. * It provides a secure, vibration-resistant mount for mobile or industrial equipment. * The system includes a pre-assembled brass spring to prevent over-tightening and component damage. #### C. Material Properties * **Aluminum Construction:** Offers a balance of high thermal conductivity and lightweight properties. * **Black Anodized Finish:** Improves radiant heat transfer and provides electrical insulation and corrosion resistance for the metal surface. --- ### 3. Typical Applications * **Networking:** Routers, switches, and high-speed modems. * **Computing:** Secondary cooling for voltage regulator modules (VRMs) or chipsets. * **Industrial:** Power supplies and motor controllers that generate significant localized heat. ---
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole patterns for the pushPIN™ attachment?
    • ⤷ How does the thermal resistance change at higher airflows (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Is a pre-applied Thermal Interface Material (TIM) included with this part number?