AI

The **ATS-20F-176-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like CPUs, GPUs, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table outlines the key physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (Black Anodized) |
| **Thermal Resistance** | 2.50°C/W @ 200 LFM |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W)** | 40.00mm x 40.00mm |
| **Height** | 25.00mm |
| **Fin Style** | Tapered (High Performance) |
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### 2. Key Electronic Features
#### A. Thermal Management Design
The heat sink utilizes a **tapered fin design**, which increases the surface area for heat dissipation while reducing pressure drop. This allows for maximum airflow through the fin field, making it ideal for high-density electronic assemblies.
#### B. pushPIN™ Attachment System
Instead of simple adhesive tape, this model uses a **pushPIN™** mechanism. This is critical for electronics because:
* It ensures a **consistent pressure** across the component, improving thermal interface material (TIM) performance.
* It provides a secure, vibration-resistant mount for mobile or industrial equipment.
* The system includes a pre-assembled brass spring to prevent over-tightening and component damage.
#### C. Material Properties
* **Aluminum Construction:** Offers a balance of high thermal conductivity and lightweight properties.
* **Black Anodized Finish:** Improves radiant heat transfer and provides electrical insulation and corrosion resistance for the metal surface.
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### 3. Typical Applications
* **Networking:** Routers, switches, and high-speed modems.
* **Computing:** Secondary cooling for voltage regulator modules (VRMs) or chipsets.
* **Industrial:** Power supplies and motor controllers that generate significant localized heat.
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- ⤷
What are the compatible PCB hole patterns for the pushPIN™ attachment?
- ⤷ How does the thermal resistance change at higher airflows (e.g.
- ⤷ 500 LFM)?
- ⤷ Is a pre-applied Thermal Interface Material (TIM) included with this part number?