The **ATS-20F-180-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling electronic components such as CPUs, GPUs, or high-power FPGAs. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Resistance** | 3.32°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Type** | XC-Cut (Cross-cut) | --- ### 2. Design Breakdown #### A. XC-Cut Fin Design The "XC-Cut" refers to a cross-cut fin pattern. Unlike straight fins, these create a grid of square or rectangular pins. This design is highly efficient because: * It allows for **omnidirectional airflow**, meaning the air can enter the heat sink from any side. * It increases the surface area for heat dissipation while maintaining low weight. #### B. Push-Pin Attachment Mechanism This part uses a specific mechanical attachment system: * **Hole Pattern:** It requires pre-drilled holes in the PCB. * **Compression Spring:** A brass or steel spring provides constant pressure on the electronic chip, ensuring optimal contact between the heat sink base and the component surface. * **Stability:** Unlike adhesive tapes, push-pins offer a secure mechanical fix that is resistant to vibration. #### C. Thermal Interface Material (TIM) The part typically comes with a pre-applied **Phase Change Material (PCM)** or a high-performance thermal pad. This fills the microscopic air gaps between the chip and the heat sink to maximize heat transfer. --- ### 3. Part Number Decoder (Example) To understand the specific electronic properties of this series: * **ATS:** Brand (Advanced Thermal Solutions). * **20:** Series type. * **F:** Fin pitch/Density. * **180:** Designates the specific height and fin configuration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code. --- ### 4. Typical Applications * **Networking Equipment:** Routers, switches, and base stations. * **Industrial PCs:** Compact systems requiring passive or active cooling. * **Embedded Systems:** High-density boards where vertical clearance is limited to 25mm.