The **ATS-20F-186-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The part number follows a specific naming convention that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 2.80°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 35.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Components & Materials This electronic part is composed of several critical elements that ensure efficient cooling: * **Heat Sink Body:** Constructed from high-grade aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. * **pushPIN™ Attachment:** This system uses a flexible spring-loaded pin mechanism. It ensures constant pressure between the heat sink and the electronic component, which is vital for optimal heat transfer. * **Thermal Interface Material (TIM):** This part usually comes with pre-applied **ATS-PPS-20** (or similar) thermal grease or pads. This fills the microscopic air gaps between the component and the heat sink. * **Blue Anodized Finish:** Beyond aesthetics, the anodized coating provides corrosion resistance and increases surface emissivity, slightly improving radiation cooling. --- ### 3. Thermal Performance (Flow Rate) The effectiveness of the ATS-20F-186-C2-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM) within the electronic enclosure. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.80 | | 200 (1.0 m/s) | 1.71 | | 300 (1.5 m/s) | 1.39 | | 400 (2.0 m/s) | 1.22 | --- ### 4. Implementation Considerations When integrating this part into a PCB design, engineers must consider: 1. **Hole Pattern:** The PCB must have specific drill holes to accommodate the push-pins (usually at a pitch of 45.00mm for this series). 2. **Keep-out Zone:** Ensure no surface-mount components (SMD) are placed under the footprint of the heat sink that might interfere with the flat contact base. 3. **Component Height:** With a 35mm height, it is a "high profile" heat sink, which may not fit in 1U server racks or ultra-thin enclosures.