ATS-20F-202-C2-R0
AI

The **ATS-20F-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed specifically for cooling electronic components like CPUs, GPUs, or power transistors that generate significant heat in confined spaces.
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## 1. Key Specifications
The technical properties of this specific model are detailed in the table below:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-20F-202-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Fin Type** | Straight Fin |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions (LxWxH)** | 54.00 mm x 54.00 mm x 10.00 mm |
| **Thermal Resistance** | 14.83 °C/W (Unducted Flow @ 100 LFM) |
| **Finish** | Blue Anodized |
| **Thermal Interface** | T766 (Pre-applied Phase Change Material) |
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## 2. Component Breakdown
### A. The Heat Sink Body
The unit is made from **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **Straight Fin** design is optimized for environments where there is a consistent directional airflow (ducted or unducted).
### B. The pushPIN™ Attachment System
Instead of using messy adhesives or permanent solder, this part uses a mechanical push-pin system.
* **Ease of Use:** Allows for quick installation and removal.
* **Constant Pressure:** The springs ensure even pressure across the component surface, maximizing heat transfer.
### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates the use of **T766** thermal material. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the electronic chip to reduce thermal resistance.
### D. Finish (Blue Anodized)
The blue anodized coating is not just for aesthetics; it provides:
1. **Corrosion Resistance:** Protects the aluminum from oxidation.
2. **Increased Emissivity:** Slightly improves heat dissipation through radiation.
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## 3. Performance Metrics
Thermal resistance indicates how effectively the part moves heat away from the component.
| Airflow Velocity (LFM) | 100 (0.5m/s) | 200 (1.0m/s) | 300 (1.5m/s) | 400 (2.0m/s) |
| :--- | :--- | :--- | :--- | :--- |
| **Unducted (°C/W)** | 14.83 | 6.91 | 5.31 | 4.44 |
| **Ducted (°C/W)** | 5.23 | 3.90 | 3.28 | 2.88 |
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- ⤷
What are the PCB hole requirements for the pushPIN attachment?
- ⤷ How does 'Ducted' vs 'Unducted' airflow affect the cooling performance?
- ⤷ Is there a weight limit for the components this heat sink can be mounted on?