ATS-20F-206-C2-R0
AI

The **ATS-20F-206-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table highlights the critical physical and thermal properties of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance (Unducted)** | 7.71 °C/W @ 100 LFM |
| **Thermal Interface Material** | T766 (Pre-applied) |
| **Fin Style** | Fine-Pitch (Straight) |
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### 2. Electronic Application & Function
This component is vital for maintaining the "Thermal Budget" of a PCB. Here is how it functions within an electronic system:
* **Heat Dissipation:** It increases the surface area of a high-heat component, allowing air to carry away thermal energy that would otherwise lead to **thermal throttling** or hardware failure.
* **Push-Pin Attachment:** Unlike adhesive-based heat sinks, the push-pin mechanism provides a consistent **clamping force**. This ensures the Thermal Interface Material (TIM) is compressed evenly for maximum conductivity.
* **Acoustic Management:** Because of its high efficiency (Fine-Pitch fins), it can often achieve cooling targets at lower fan speeds, reducing the overall noise profile of the device.
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### 3. Component Breakdown (Naming Convention)
The part number can be decoded to understand its specific features:
1. **ATS:** Advanced Thermal Solutions (Manufacturer).
2. **20F:** Series/Family (pushPIN™ Heat Sink).
3. **206:** Specific footprint and fin geometry.
4. **C2:** Material/Finish code (Blue Anodized).
5. **R0:** Revision or Packaging code.
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### 4. Typical Integration (Design-in)
When integrating this part into a CAD layout, the engineer must account for the **hole pattern** on the PCB:
```text
Hole Pitch: 47.00mm (Square)
Recommended Hole Size: 3.175mm (1/8")
```
- ⤷
What is the thermal resistance of this heat sink at high airflow speeds?
- ⤷ How does the T766 interface material compare to standard thermal paste?
- ⤷ Are there alternative attachment methods for this specific heat sink size?