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  • ATS-20F-206-C2-R0

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    The **ATS-20F-206-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the critical physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 7.71 °C/W @ 100 LFM | | **Thermal Interface Material** | T766 (Pre-applied) | | **Fin Style** | Fine-Pitch (Straight) | --- ### 2. Electronic Application & Function This component is vital for maintaining the "Thermal Budget" of a PCB. Here is how it functions within an electronic system: * **Heat Dissipation:** It increases the surface area of a high-heat component, allowing air to carry away thermal energy that would otherwise lead to **thermal throttling** or hardware failure. * **Push-Pin Attachment:** Unlike adhesive-based heat sinks, the push-pin mechanism provides a consistent **clamping force**. This ensures the Thermal Interface Material (TIM) is compressed evenly for maximum conductivity. * **Acoustic Management:** Because of its high efficiency (Fine-Pitch fins), it can often achieve cooling targets at lower fan speeds, reducing the overall noise profile of the device. --- ### 3. Component Breakdown (Naming Convention) The part number can be decoded to understand its specific features: 1. **ATS:** Advanced Thermal Solutions (Manufacturer). 2. **20F:** Series/Family (pushPIN™ Heat Sink). 3. **206:** Specific footprint and fin geometry. 4. **C2:** Material/Finish code (Blue Anodized). 5. **R0:** Revision or Packaging code. --- ### 4. Typical Integration (Design-in) When integrating this part into a CAD layout, the engineer must account for the **hole pattern** on the PCB: ```text Hole Pitch: 47.00mm (Square) Recommended Hole Size: 3.175mm (1/8") ```
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink at high airflow speeds?
    • ⤷ How does the T766 interface material compare to standard thermal paste?
    • ⤷ Are there alternative attachment methods for this specific heat sink size?