The **ATS-20F-26-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "maxiFLOW" series, designed for high-efficiency cooling in constrained spaces. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Heat Sink Type** | Top Mount / maxiFLOW | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 70mm x 70mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.42°C/W @ 200 LFM | | **Airflow Direction** | Vertical / Omni-directional (Pin Fin) | | **Fin Style** | Tapered Fin (spreads airflow) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: - **ATS**: Manufacturer (Advanced Thermal Solutions). - **20F**: Series designation (maxiFLOW™ with pushPIN™ attachment). - **26**: Size or configuration identifier. - **C2**: Material/Finish code (Typically indicates Blue Anodized Aluminum). - **R0**: Revision or packaging code. --- ### 3. Key Electronic/Thermal Features #### A. Pin Fin Design Unlike traditional straight-fin heat sinks, the maxiFLOW design features a flared, tapered fin structure. This increases surface area and creates turbulence, which significantly improves heat dissipation in low-to-medium airflow environments. #### B. pushPIN™ Attachment This part uses a specific mounting mechanism: - **Consistent Pressure**: Uses a brass or plastic pin with a stainless steel spring. - **Reliability**: Ensures the thermal interface material (TIM) is compressed evenly across the electronic component (CPU, GPU, or FPGA). - **Ease of Assembly**: Can be installed quickly on PCBs with pre-drilled holes. #### C. Thermal Interface Material (TIM) Usually, these parts come with a pre-applied **Phase Change Material** or high-performance thermal pad on the base to ensure maximum heat transfer from the electronic chip to the aluminum sink. --- ### 4. Common Applications This heat sink is typically found in: 1. **Telecommunications**: High-speed routers and switches. 2. **Embedded Systems**: Industrial PC processors. 3. **Power Electronics**: Cooling for large MOSFET arrays or IGBTs. 4. **Computing**: Specialized cooling for FPGAs (Field Programmable Gate Arrays).