The **ATS-20F-41-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **heat sink** designed for cooling integrated circuits (ICs), particularly those used in telecommunications and high-speed networking applications. Below is a detailed breakdown of its specifications and electronic properties. --- ## 1. Technical Specifications This part belongs to the **maxiFLOW™** series, which uses a flared-fin design to maximize air contact. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-20F-41-C3-R0 | | **Component Type** | Passive Heat Sink | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.07°C/W (Unducted Flow @ 100 LFM) | --- ## 2. Mechanical Dimensions Understanding the footprint is critical for PCB layout and ensuring the component fits within the electronic enclosure. * **Length x Width:** 45mm x 45mm * **Height:** 10mm (Low Profile) * **Pin-to-Pin Distance:** 38mm (Standard spacing for pushPIN attachment) * **Weight:** Approximately 12.0 grams --- ## 3. Key Features * **Flared Fin Geometry:** The fins are angled outwards. This reduces pressure drop and increases the surface area for heat dissipation, making it more efficient than straight-fin designs in low-airflow environments. * **pushPIN™ Attachment:** The "20F" designation indicates it uses a specific spring-loaded pin mechanism. This provides a precise, consistent pressure against the electronic chip, ensuring optimal thermal interface material (TIM) performance. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412**, a high-performance thermal tape/pad that facilitates heat transfer from the silicon to the aluminum fins. * **C3 Rating:** The "C3" in the part number indicates the specific spring and pin hardware kit included (usually a stainless steel spring and plastic pin). --- ## 4. Electronic Application This part is used to prevent **thermal throttling** or component failure in: 1. **Microprocessors (CPUs) & FPGAs:** Keeping high-speed logic gates within operating temperature limits. 2. **ASICs:** Used in networking switches and routers. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ## 5. Thermal Performance Table Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.07 | | 200 (1.0 m/s) | 3.53 | | 400 (2.0 m/s) | 2.15 | | 600 (3.0 m/s) | 1.66 | ---