The **ATS-20F-47-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide high-efficiency cooling for high-power electronic components. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Base Dimensions** | 45mm x 45mm | | **Height** | 24.5mm | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Brass pins) | | **Thermal Resistance** | 2.30°C/W (at 200 LFM) | | **Fin Style** | Tapered (Spread Fin) | --- ### 2. Design and Component Features The "ATS-20F-47-C3-R0" features several engineering choices tailored for PCB-level cooling: #### A. Fin Geometry (maxiFLOW™) Unlike standard straight-fin heat sinks, this model uses a **tapered fin design**. This creates a larger surface area for heat dissipation while maintaining a low pressure drop. The "Spread Fin" layout allows for better airflow intake from various directions. #### B. pushPIN™ Attachment The part uses a specialized attachment system: * **Compression Springs:** Ensure consistent pressure (Load) across the TIM (Thermal Interface Material) for maximum heat transfer. * **Brass Pins:** Provide a secure mechanical connection to the PCB via pre-drilled holes. #### C. Blue Anodized Finish The surface is treated with a **blue anodized coating**, which increases the emissivity of the aluminum, allowing for slightly better radiant heat transfer and providing corrosion resistance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify the exact variant: | Segment | Meaning | | :--- | :--- | | **ATS-20** | Series/Product Family (pushPIN™ Heat Sink) | | **F** | Fin Pitch/Pattern (Fine) | | **47** | Size Code (Corresponds to 45mm-47mm dimensions) | | **C3** | Thermal Interface Material (Pre-applied Phase Change Material) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Typical Applications This component is commonly found on: * **FPGAs & ASICs:** High-density chips in networking equipment. * **Processors:** Embedded CPUs in industrial computers. * **Power Supplies:** Cooling MOSFETs or power conversion modules.