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  • ATS-20F-49-C3-R0

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    The **ATS-20F-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs). ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Blue Anodized Aluminum | | **Attachment Method** | Push Pin (with Springs) | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height (Height Off Base)** | 10.00 mm | | **Fin Pattern** | Fine Pitch (Rectangular) | | **Thermal Resistance** | ~26.0°C/W (at 100 LFM) | --- ### 2. Key Components & Materials * **Base Material:** Extruded Aluminum (6063). This material is chosen for its excellent thermal conductivity and lightweight properties. * **Finish:** Blue Anodized. This protective layer prevents corrosion and increases the surface emissivity, slightly improving radiant heat transfer. * **Attachment Mechanism:** Utilizes a **Push Pin** system with a brass or plastic pin and a high-tension spring. This ensures consistent pressure (TIM compression) across the chip surface. * **Thermal Interface Material (TIM):** Typically comes pre-applied with **T412** or similar phase-change material or thermal tape to ensure no air gaps exist between the heat sink and the electronic component. --- ### 3. Application & Usage This specific part is typically found in space-constrained electronic environments where active airflow is present. * **Target Components:** BGA (Ball Grid Array) chips, CPUs, GPUs, and power transistors. * **Common Industries:** Networking (routers/switches), Telecommunications, and Embedded Systems. * **Thermal Performance:** The "Fine Pitch" fin design is optimized for systems with a steady flow of air (forced convection). Because it is only 10mm tall, it is ideal for low-profile chassis. --- ### 4. Part Number Breakdown Understanding the ATS nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS-20** | Series/Standard Reference | | **F** | Fine pitch fin configuration | | **49** | Size/Model identifier | | **C3** | Material/Finish code (Blue Anodized) | | **R0** | Revision or Packaging code |
    ✨ Follow-up Questions
    • ⤷ What is the difference between push-pin and adhesive mounting for this heat sink?
    • ⤷ How do I calculate if the 26.0°C/W thermal resistance is sufficient for my chip?
    • ⤷ Are there taller versions of the ATS-49 series available for better cooling?