ATS-20F-49-C3-R0
AI

The **ATS-20F-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs).
### 1. Technical Specifications
The following table highlights the primary physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Heat Sink Type** | Blue Anodized Aluminum |
| **Attachment Method** | Push Pin (with Springs) |
| **Dimensions (L x W)** | 30.00 mm x 30.00 mm |
| **Height (Height Off Base)** | 10.00 mm |
| **Fin Pattern** | Fine Pitch (Rectangular) |
| **Thermal Resistance** | ~26.0°C/W (at 100 LFM) |
---
### 2. Key Components & Materials
* **Base Material:** Extruded Aluminum (6063). This material is chosen for its excellent thermal conductivity and lightweight properties.
* **Finish:** Blue Anodized. This protective layer prevents corrosion and increases the surface emissivity, slightly improving radiant heat transfer.
* **Attachment Mechanism:** Utilizes a **Push Pin** system with a brass or plastic pin and a high-tension spring. This ensures consistent pressure (TIM compression) across the chip surface.
* **Thermal Interface Material (TIM):** Typically comes pre-applied with **T412** or similar phase-change material or thermal tape to ensure no air gaps exist between the heat sink and the electronic component.
---
### 3. Application & Usage
This specific part is typically found in space-constrained electronic environments where active airflow is present.
* **Target Components:** BGA (Ball Grid Array) chips, CPUs, GPUs, and power transistors.
* **Common Industries:** Networking (routers/switches), Telecommunications, and Embedded Systems.
* **Thermal Performance:** The "Fine Pitch" fin design is optimized for systems with a steady flow of air (forced convection). Because it is only 10mm tall, it is ideal for low-profile chassis.
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### 4. Part Number Breakdown
Understanding the ATS nomenclature helps in identifying variants:
| Segment | Meaning |
| :--- | :--- |
| **ATS-20** | Series/Standard Reference |
| **F** | Fine pitch fin configuration |
| **49** | Size/Model identifier |
| **C3** | Material/Finish code (Blue Anodized) |
| **R0** | Revision or Packaging code |
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What is the difference between push-pin and adhesive mounting for this heat sink?
- ⤷ How do I calculate if the 26.0°C/W thermal resistance is sufficient for my chip?
- ⤷ Are there taller versions of the ATS-49 series available for better cooling?