The **ATS-20F-50-C3-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-20F-50-C3-R0 | | **Heat Sink Type** | Push-Pin (XCUT) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | ~1.88°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring compatibility with the Printed Circuit Board (PCB) layout and surrounding components. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 10.00 mm * **Pitch (Hole-to-Hole):** 38.00 mm --- ### 3. Key Electronic Features #### A. XCUT Fin Design The "F" in the part number indicates a specific fin pattern (Cross-Cut). This design allows for multidirectional airflow, making it highly effective in environments where air direction is not strictly linear. #### B. Push-Pin Attachment Instead of using messy thermal adhesives or complex brackets, this part uses a **Push-Pin** system with a compression spring. * **Reliability:** Ensures consistent pressure across the component for optimal heat transfer. * **Safety:** The spring prevents over-tightening which could crack the silicon die. #### C. Thermal Interface Material (T412) The unit comes with **T412** thermal tape pre-applied. This material fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering the thermal resistance. --- ### 4. Typical Applications This specific size and thermal profile are commonly found in: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PC controllers. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators.