The part number **ATS-20F-52-C3-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* thermal management series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Thermal Management) | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.88 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 25mm | | **Fin Style** | Straight (Vertical) | --- ### 2. Breakdown of the Part Number Advanced Thermal Solutions uses a specific nomenclature to describe the part's features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **20**: The specific family/series of heat sinks. * **F**: Fin pitch/pattern type. * **52**: Specific dimensions and internal design code. * **C3**: Thermal Interface Material (TIM) code. In this case, it usually indicates the use of **T766** high-performance phase-change material or grease. * **R0**: RoHS Compliance status (Lead-free). --- ### 3. Key Electronic Applications This heat sink is designed for board-level thermal management where space is limited but high dissipation is required: 1. **High-Speed Processing:** Used on networking chips or logic controllers. 2. **Embedded Systems:** Ideal for small form factor industrial computers. 3. **Prototyping:** The push-pin design allows for easy installation and removal without the need for adhesive tapes that can fail over time. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute) within the electronic enclosure: ```python # Approximate Thermal Resistance (Lower is better) airflow_data = { "LFM_100": "15.00 °C/W", "LFM_200": "10.88 °C/W", "LFM_300": "8.10 °C/W", "LFM_500": "5.50 °C/W" } ``` ---