The **ATS-20F-71-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to cool electronic components like CPUs, GPUs, or power transistors by increasing the surface area for heat dissipation. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 30mm | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~1.15 °C/W (at 200 LFM) | --- ### 2. Breakdown of the Model Number The part number can be decoded to understand the specific configuration: * **ATS-20**: Refers to the series (High-performance straight fin design). * **F**: Likely refers to the specific fin density or manufacturing process. * **71**: Dimensional code representing the 45x45x30mm size. * **C3**: Indicates the Thermal Interface Material (TIM) and color (Blue Anodized). * **R0**: Revision or packaging code. --- ### 3. Key Electronic Functions While the heat sink itself is passive, it is critical for the following electronic functions: 1. **Thermal Dissipation**: Conducts heat away from the semiconductor die via the baseplate and radiates it into the surrounding air through the vertical fins. 2. **Junction Temperature Control**: Prevents the internal temperature of integrated circuits from exceeding the maximum limit (usually 125°C - 150°C), which prevents "Thermal Throttling" or permanent damage. 3. **Mechanical Stability**: The **Push-Pin** mechanism provides a constant force (pressure) on the chip, ensuring that the Thermal Interface Material (TIM) is spread evenly for optimal heat transfer. --- ### 4. Component Materials * **Heat Sink**: Made of **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. * **Coating**: **Blue Anodizing** provides corrosion resistance and increases surface emissivity. * **Springs/Pins**: Usually stainless steel springs with nylon pins, designed for a specific hole diameter on the Printed Circuit Board (PCB).