The **ATS-20F-74-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** heat sink from the *maxiFLOW* series. It is designed to dissipate heat from surface-mount components like BGA (Ball Grid Array) packages. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Series** | maxiFLOW | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Thermal Resistance** | 8.97°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 50mm x 50mm x 25mm | | **Fin Type** | Fine Pitch (Tapered) | --- ### 2. Key Electronic Features #### A. pushPIN™ Attachment System The part uses a specialized "pushPIN" mechanism. In PCB design, this ensures: * **Constant Pressure:** A pre-assembled compression spring provides precise, uniform pressure on the electronic chip, optimizing thermal interface material (TIM) performance. * **Reliability:** It prevents the heat sink from shifting during mechanical shock or vibration, which is critical for industrial electronics. #### B. maxiFLOW™ Design The "maxiFLOW" geometry features a spread fin structure. In an electronic enclosure: * It reduces **pressure drop**, allowing air to move more freely through the fins. * It maximizes surface area for heat radiation, making it suitable for high-power processors, FPGAs, or GPUs. #### C. Thermal Performance (Efficiency) Thermal resistance is the critical metric for electronic protection. The performance varies based on airflow (velocity): | Air Velocity (LFM) | Thermal Resistance (°C/W) | |:---|:---| | 100 (0.5 m/s) | 8.97 | | 300 (1.5 m/s) | 3.28 | | 500 (2.5 m/s) | 2.11 | --- ### 3. Application Use Cases This part is typically found in: 1. **Telecommunications:** Cooling high-speed switching silicon. 2. **Embedded Computing:** Protecting CPUs in industrial motherboards. 3. **Power Supplies:** Dissipating heat from large MOSFET arrays. --- ### 4. Part Number Breakdown The nomenclature follows this standard logic: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **20F:** Specific series/size category. * **74:** Internal design/fin configuration code. * **C3:** Material/Finish code (Blue Anodized). * **R0:** Revision/Packaging status.