The **ATS-20F-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling processors and other surface-mount components. ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 7.21°C/W (at 200 LFM) | | **Compatibility** | Universal (based on hole pattern) | --- ### 2. Design and Component Breakdown #### A. The Heat Sink Body The body is constructed from high-grade aluminum. The **straight fin** design is optimized for "cross-cut" airflow or unidirectional airflow. The blue anodized finish is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. #### B. The Attachment Mechanism (Push-Pin) This part utilizes a **Push-Pin and Spring** system: * **Plastic Push-Pins:** Allows for quick and secure attachment to the Printed Circuit Board (PCB). * **Springs:** Provides consistent "Normal Force" (downward pressure), which ensures the thermal interface material (TIM) makes optimal contact between the heat sink and the electronic chip. #### C. Thermal Interface Material (TIM) The "C3" in the part number often indicates a pre-applied thermal interface. This is typically a high-efficiency phase-change material or thermal pad, eliminating the need for manual application of thermal paste. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): * **Low Airflow (200 LFM):** ~7.21°C/W thermal resistance. * **High Airflow (800 LFM):** Performance increases significantly, dropping resistance to ~2.80°C/W. --- ### 4. Common Applications This specific size (30mm x 30mm) and height (25mm) is typically used for: 1. **Network Switches/Routers:** Cooling ASICs and FPGAs. 2. **Power Supplies:** Heat dissipation for MOSFETs. 3. **Embedded Systems:** Industrial PCs where active fan cooling may be limited.