The **ATS-20F-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and surface-mount devices. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height (Height Off Base)** | 25.00 mm | | **Thermal Resistance** | 2.52°C/W @ 200 LFM | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Detailed Component Breakdown #### A. The Fin Design (Straight Fin) The "Straight Fin" design is optimized for **undirected airflow**. Because the fins run in parallel lines, they provide a large surface area for heat dissipation while maintaining a low pressure drop. This is ideal for systems where a chassis fan provides consistent air movement across the PCB. #### B. The Push-Pin Mounting System Unlike adhesive-based heat sinks, the **ATS-20F-82-C3-R0** uses a mechanical push-pin system: * **Stability:** Provides consistent pressure (clamping force) on the high-heat component. * **Reliability:** Not susceptible to adhesive "drying out" over time. * **Installation:** Requires pre-drilled holes in the PCB (standard 2-hole pattern). #### C. Thermal Interface Material (T412) The unit comes with **T412** thermal tape pre-applied to the base. * This material fills microscopic air gaps between the heat sink and the chip. * It eliminates the need for manual application of thermal grease during assembly. --- ### 3. Part Number Decoder The manufacturer part number follows a specific nomenclature: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **20F** | Series/Footprint Family | | **82** | Specific Fin Geometry/Height Configuration | | **C3** | Material/Finish (Blue Anodized Aluminum) | | **R0** | Revision or Packaging code | --- ### 4. Typical Applications * **Network Switches/Routers:** Cooling BGAs and processors. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators.