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  • ATS-20F-85-C3-R0

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    The **ATS-20F-85-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling in constrained spaces. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Blue Anodized Aluminum | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Base Dimensions** | 35.00 mm x 35.00 mm | | **Height** | 25.00 mm | | **Thermal Resistance** | 2.01 °C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | T412 (High Performance) | | **Flow Pattern** | maxiFLOW (Directional) | --- ## 2. Key Electronic Features ### Thermal Efficiency The part utilizes the **maxiFLOW™** fin geometry, which is designed to maximize surface area while reducing pressure drop. This is critical for cooling high-power electronic components like: * FPGAs (Field Programmable Gate Arrays) * ASICs (Application-Specific Integrated Circuits) * Microprocessors ### The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the `-R0` suffix indicates a **pushPIN™** assembly. This provides several benefits for PCB design: * **Precision Pressure:** Ensures consistent contact between the heat sink and the chip. * **Secure Mounting:** Features a stainless steel spring for vibration resistance. * **Removability:** Allows for easier maintenance or rework of the electronic board compared to epoxy. ### Thermal Interface Material (T412) The part comes pre-applied with **T412**, a phase-change material. This eliminates the need for manual thermal paste application, ensuring a low thermal impedance path between the silicon die and the aluminum fins. --- ## 3. Physical Layout The design follows a specific "F" (Fine pitch) fin density, optimized for forced-air cooling environments. ```text [ Top View ] 35.00mm +-------+ | ||||| | | ||||| | <-- Aluminum Fins | ||||| | +-------+ 35.00mm [ Side View ] _______ <-- Fin Height (25mm) | | | | ------- <-- Base (Blue Anodized) | | <-- pushPINs (Brass) ``` ---
    ✨ Follow-up Questions
    • ⤷ What are the specific airflow requirements (LFM) to reach optimal thermal resistance for this part?
    • ⤷ How does the T412 interface material compare to standard thermal grease?
    • ⤷ Are there alternative attachment methods for this specific heat sink model?