ATS-20F-85-C3-R0
AI

The **ATS-20F-85-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling in constrained spaces.
---
## 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Material** | Blue Anodized Aluminum |
| **Attachment Method** | pushPIN™ (Brass Pins) |
| **Base Dimensions** | 35.00 mm x 35.00 mm |
| **Height** | 25.00 mm |
| **Thermal Resistance** | 2.01 °C/W (@ 100 LFM) |
| **Thermal Interface Material (TIM)** | T412 (High Performance) |
| **Flow Pattern** | maxiFLOW (Directional) |
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## 2. Key Electronic Features
### Thermal Efficiency
The part utilizes the **maxiFLOW™** fin geometry, which is designed to maximize surface area while reducing pressure drop. This is critical for cooling high-power electronic components like:
* FPGAs (Field Programmable Gate Arrays)
* ASICs (Application-Specific Integrated Circuits)
* Microprocessors
### The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, the `-R0` suffix indicates a **pushPIN™** assembly. This provides several benefits for PCB design:
* **Precision Pressure:** Ensures consistent contact between the heat sink and the chip.
* **Secure Mounting:** Features a stainless steel spring for vibration resistance.
* **Removability:** Allows for easier maintenance or rework of the electronic board compared to epoxy.
### Thermal Interface Material (T412)
The part comes pre-applied with **T412**, a phase-change material. This eliminates the need for manual thermal paste application, ensuring a low thermal impedance path between the silicon die and the aluminum fins.
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## 3. Physical Layout
The design follows a specific "F" (Fine pitch) fin density, optimized for forced-air cooling environments.
```text
[ Top View ]
35.00mm
+-------+
| ||||| |
| ||||| | <-- Aluminum Fins
| ||||| |
+-------+
35.00mm
[ Side View ]
_______ <-- Fin Height (25mm)
| | | |
------- <-- Base (Blue Anodized)
| | <-- pushPINs (Brass)
```
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- ⤷
What are the specific airflow requirements (LFM) to reach optimal thermal resistance for this part?
- ⤷ How does the T412 interface material compare to standard thermal grease?
- ⤷ Are there alternative attachment methods for this specific heat sink model?