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  • ATS-20F-86-C3-R0

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    The **ATS-20F-86-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 35mm x 35mm x 15mm | | **Thermal Resistance** | 6.72°C/W (at 1.0 m/s airflow) | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic Components & Materials The effectiveness of this part relies on the synergy of its mechanical components: * **Heat Sink Body:** Extruded aluminum allows for high thermal conductivity. The "Straight Fin" design is optimized for environments with consistent directional airflow. * **Push-Pin Attachment:** Features a brass pin with a plastic or metal tip that snaps into pre-drilled holes in the PCB. This ensures a consistent downward force (pressure) on the chip. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or a similar phase-change material pre-applied to the base to bridge the microscopic air gaps between the component (CPU/GPU) and the heat sink. * **Spring Assembly:** The compression spring ensures that even with vibration or thermal expansion, the heat sink maintains firm contact with the electronic component. --- ### 3. Application Use Cases The ATS-20F-86-C3-R0 is commonly used in high-density electronic environments such as: 1. **Network Switches/Routers:** Cooling BGAs (Ball Grid Arrays) and ASICs. 2. **Power Supplies:** Dissipating heat from power transistors. 3. **Embedded Systems:** Industrial PCs where mechanical stability is required due to movement. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air moving through the fins: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 6.72 | | 400 | 2.0 | 3.30 | | 600 | 3.0 | 2.42 |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin mounting of this heat sink?
    • ⤷ Can this heat sink be used with a fan for active cooling?
    • ⤷ What is the difference between Blue Anodized and Black Anodized finishes in terms of performance?