ATS-20F-86-C3-R0
AI

The **ATS-20F-86-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to Printed Circuit Boards (PCBs).
### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Dimensions** | 35mm x 35mm x 15mm |
| **Thermal Resistance** | 6.72°C/W (at 1.0 m/s airflow) |
| **Fin Style** | Straight Fin |
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### 2. Key Electronic Components & Materials
The effectiveness of this part relies on the synergy of its mechanical components:
* **Heat Sink Body:** Extruded aluminum allows for high thermal conductivity. The "Straight Fin" design is optimized for environments with consistent directional airflow.
* **Push-Pin Attachment:** Features a brass pin with a plastic or metal tip that snaps into pre-drilled holes in the PCB. This ensures a consistent downward force (pressure) on the chip.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or a similar phase-change material pre-applied to the base to bridge the microscopic air gaps between the component (CPU/GPU) and the heat sink.
* **Spring Assembly:** The compression spring ensures that even with vibration or thermal expansion, the heat sink maintains firm contact with the electronic component.
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### 3. Application Use Cases
The ATS-20F-86-C3-R0 is commonly used in high-density electronic environments such as:
1. **Network Switches/Routers:** Cooling BGAs (Ball Grid Arrays) and ASICs.
2. **Power Supplies:** Dissipating heat from power transistors.
3. **Embedded Systems:** Industrial PCs where mechanical stability is required due to movement.
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### 4. Thermal Performance Data
Performance varies based on the velocity of the air moving through the fins:
| Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 200 | 1.0 | 6.72 |
| 400 | 2.0 | 3.30 |
| 600 | 3.0 | 2.42 |
- ⤷
What are the PCB hole requirements for the push-pin mounting of this heat sink?
- ⤷ Can this heat sink be used with a fan for active cooling?
- ⤷ What is the difference between Blue Anodized and Black Anodized finishes in terms of performance?