The **ATS-20F-87-C3-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, thermal resistance, and mounting style. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Mounting Type** | Push-Pin (Spring-loaded) | | **Dimensions** | 35mm x 35mm | | **Height (Fin)** | 15mm | | **Thermal Resistance** | 13.30°C/W (at 100 LFM) | | **Attachment Hole Pattern** | 4-Corner / Specific Pitch for PCB | --- ### 2. Breakdown of the Part Number To understand the electronic application, we can decode the suffix: * **ATS-20**: Series identifier (typically indicates the specific fin geometry or product family). * **F**: Indicates a specific fin profile or mounting configuration. * **87**: Dimensional code (refers to the 35mm x 35mm footprint). * **C3**: Refers to the thermal interface material (TIM) or the specific blue anodized finish used for corrosion resistance and emissivity. * **R0**: Versioning code or RoHS compliance status. --- ### 3. Electronic Components Managed This heat sink is designed for mid-range power dissipation and is commonly found cooling the following electronic parts: 1. **BGA (Ball Grid Array) Packages:** CPUs, GPUs, or network processors in embedded systems. 2. **FPGAs:** Logic gates that generate significant heat during high-speed switching. 3. **ASICs:** Application-specific integrated circuits used in networking or mining equipment. 4. **Power Converters:** High-density DC-DC converters that require passive airflow cooling. --- ### 4. Thermal Performance The performance of this heat sink is highly dependent on airflow (LFM - Linear Feet per Minute). | Airflow Rate (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Static/Low)** | 13.30 | | **200 (Moderate)** | 6.77 | | **400 (High)** | 4.80 | --- ### 5. Installation Note The **Push-Pin** mechanism is preferred for automated assembly. It uses a spring-loaded plastic or brass pin that snaps into pre-drilled holes in the PCB. This ensures constant pressure on the electronic component, maximizing the effectiveness of the pre-applied **Phase Change Material (PCM)** or thermal grease.