The **ATS-20F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other heat-generating components to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the component. | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 21.97 °C/W (Unducted @ 100 LFM) | | **Number of Fins** | Fine Pitch Cross-Cut | --- ### 2. Physical Design Features * **Low Profile:** At only 10mm high, this part is ideal for space-constrained applications like blade servers, networking switches, or compact embedded systems. * **Cross-Cut Fin Pattern:** The "Fine Pitch" design increases surface area while allowing for multi-directional airflow, making it versatile for different cooling orientations. * **Pre-applied Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or grease pre-applied, ensuring optimal heat transfer from the chip to the aluminum base. --- ### 3. Attachment Mechanism: pushPIN™ The "20F" in the part number indicates a specific push-pin and spring assembly. * **Ease of Assembly:** It uses a spring-loaded plastic pin that snaps into pre-drilled holes on the PCB. * **Constant Pressure:** The spring mechanism ensures consistent pressure between the heat sink and the component, which is critical for maintaining thermal conductivity. * **Security:** Unlike adhesive tapes, the mechanical push-pin provides a secure hold in high-vibration environments. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 21.97 | | 300 | 1.5 | 7.90 | | 500 | 2.5 | 5.01 | | 700 | 3.5 | 3.96 | --- ### 5. Common Applications * **FPGA & ASIC Cooling:** Ideal for high-speed processors in industrial hardware. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Networking Gear:** Cooling chips inside routers and high-speed modems.