The **ATS-20F-94-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 25mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 1.46 °C/W (at 200 LFM) | | **Spring Type** | ATS-PPS-20 | --- ### 2. Breakdown of the Part Number The part number follows a structured naming convention used by ATS to identify the specific configuration: * **ATS:** Brand (Advanced Thermal Solutions). * **20:** Indicates the specific spring/push-pin assembly type. * **F:** Fin pitch/style (Straight fin design). * **94:** The specific size and profile footprint. * **C2:** Material/Finish code (typically Blue Anodized Aluminum). * **R0:** Revision code or packaging indicator. --- ### 3. Key Electronic Functions While the heat sink itself is passive (no moving parts), its role in an electronic circuit is critical: * **Thermal Conductivity:** It draws heat away from the semiconductor die through a high-conductivity aluminum base. * **Increased Surface Area:** The straight fin design increases the surface area exposed to the air, allowing for more efficient heat transfer via convection (forced or natural). * **Push-Pin Mounting:** This specific model uses a "Push-Pin" mechanism. This ensures a consistent downward pressure (clamping force) on the electronic chip, which is vital for the thermal interface material (TIM) to work correctly. * **Pre-Applied Thermal Interface (TIM):** Most "R0" series parts come with pre-applied **Phase Change Material** or thermal tape to simplify the PCB assembly process. --- ### 4. Implementation Example If you were using this on a PCB, the layout would require two specific mounting holes: ```text PCB Layout Requirement: [ Hole ] <--- 45mm spacing (approx) ---> [ Hole ] ___________________________ | Heat Sink Base | | (40mm x 40mm) | |___________________________| ```