ATS-20G-07-C2-R0
AI

The **ATS-20G-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, engineered for cooling integrated circuits (ICs) and other PCB-mounted components.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Part Number** | ATS-20G-07-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Fin Type** | Fine Pitch (Cross-Cut) |
| **Attachment Method** | pushPIN™ (Spring Loaded) |
| **Thermal Resistance** | 17.00°C/W (at 100 LFM) to 2.42°C/W (at 700 LFM) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height (H)** | 12.7mm |
| **Finish** | Blue Anodized |
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### 2. Key Electronic Features
#### A. Thermal Performance
This part is designed to dissipate heat from high-speed processors or power components. The "C2" designation typically refers to the **Thermal Interface Material (TIM)** provided with the heatsink, which ensures minimal air gaps between the component and the metal surface.
#### B. Mechanical Attachment (pushPIN™)
Unlike adhesive-based heatsinks, the `ATS-20G-07-C2-R0` uses a mechanical push-pin system. This offers several electronic design advantages:
* **Constant Pressure:** Ensures uniform contact with the chip for better thermal conductivity.
* **Vibration Resistance:** Securely holds the heatsink in place during industrial or mobile use.
* **Reworkability:** Allows for easy removal and re-application without damaging the PCB.
#### C. Airflow Optimization
The "Fine Pitch" fin design is optimized for high-velocity airflow environments (forced convection). This makes it suitable for:
* Networking switches and routers.
* Embedded computing boards.
* Power supplies.
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### 3. Part Number Breakdown
Understanding the nomenclature helps in identifying its specific electronic fit:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **20**: Series designation.
* **G**: Material/Design variation.
* **07**: Specific physical footprint/height code.
* **C2**: Indicates the specific Thermal Interface Material (T766 or similar).
* **R0**: RoHS compliance (Lead-free and environmentally regulated).
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- ⤷
What are the specific mounting hole patterns required for the pushPIN system?
- ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
- ⤷ Are there alternative materials like copper available for this footprint?