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  • ATS-20G-07-C2-R0

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    The **ATS-20G-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, engineered for cooling integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Part Number** | ATS-20G-07-C2-R0 | | **Material** | Aluminum (AL6063) | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Attachment Method** | pushPIN™ (Spring Loaded) | | **Thermal Resistance** | 17.00°C/W (at 100 LFM) to 2.42°C/W (at 700 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 12.7mm | | **Finish** | Blue Anodized | --- ### 2. Key Electronic Features #### A. Thermal Performance This part is designed to dissipate heat from high-speed processors or power components. The "C2" designation typically refers to the **Thermal Interface Material (TIM)** provided with the heatsink, which ensures minimal air gaps between the component and the metal surface. #### B. Mechanical Attachment (pushPIN™) Unlike adhesive-based heatsinks, the `ATS-20G-07-C2-R0` uses a mechanical push-pin system. This offers several electronic design advantages: * **Constant Pressure:** Ensures uniform contact with the chip for better thermal conductivity. * **Vibration Resistance:** Securely holds the heatsink in place during industrial or mobile use. * **Reworkability:** Allows for easy removal and re-application without damaging the PCB. #### C. Airflow Optimization The "Fine Pitch" fin design is optimized for high-velocity airflow environments (forced convection). This makes it suitable for: * Networking switches and routers. * Embedded computing boards. * Power supplies. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying its specific electronic fit: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **20**: Series designation. * **G**: Material/Design variation. * **07**: Specific physical footprint/height code. * **C2**: Indicates the specific Thermal Interface Material (T766 or similar). * **R0**: RoHS compliance (Lead-free and environmentally regulated). ---
    ✨ Follow-up Questions
    • ⤷ What are the specific mounting hole patterns required for the pushPIN system?
    • ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
    • ⤷ Are there alternative materials like copper available for this footprint?