The **ATS-20G-147-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for cooling high-power semiconductors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Resistance** | 13.52°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Airflow Direction** | Horizontal | | **Fin Style** | maxiFLOW (Tapered Fin) | --- ### 2. Core Electronic/Thermal Components The "part" itself is a passive cooling assembly consisting of four primary sub-elements: #### A. The Heat Sink Body The body uses a **maxiFLOW™** design. Unlike standard rectangular fins, these are tapered to increase surface area while minimizing pressure drop. This allows more air to flow through the fins, which is critical in densely packed PCBs. #### B. pushPIN™ Attachment System Instead of simple adhesive tape, this model uses a mechanical **pushPIN™** system. * **Benefits:** Ensures high interface pressure for better heat transfer. * **Reliability:** Resistant to shock and vibration, unlike thermal adhesives which can fail over time. #### C. Compression Spring The "R0" designation usually refers to the specific spring tension. The spring provides a consistent force (Load) to ensure the heat sink remains in perfect contact with the processor or component. #### D. Thermal Interface Material (TIM) Usually, these parts come pre-applied with a high-performance **Thermal Phase Change Material** or a thermal pad on the base to fill microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Typical Applications This component is used to cool specific electronic packages, including: * **BGA (Ball Grid Array):** Graphics chips, FPGAs, and microprocessors. * **CPU/GPU:** Small form-factor embedded controllers. * **Telecommunications:** High-speed networking hardware where airflow is directional. --- ### 4. Part Number Breakdown Understanding the ATS naming convention: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **20G:** Part of the pushPIN™ series. * **147:** Specific size and fin geometry code. * **C2:** Material/Finish code (typically Blue or Black Anodized). * **R0:** Revision or packaging code.