The **ATS-20G-63-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number provides specific details about the dimensions, thermal resistance, and mounting style. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~1.60°C/W (at 200 LFM) | --- ### 2. Physical Design & Components The assembly consists of four primary sub-parts that work together to ensure efficient cooling: * **Heat Sink Body:** Extruded aluminum with high surface area. The blue anodized finish increases emissivity and protects the aluminum from corrosion. * **Push-Pins:** Brass pins that go through pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Springs:** These provide a consistent "clamping force" (pressure) to ensure the base of the heat sink stays in direct contact with the electronic component. * **Thermal Interface Material (TIM):** Usually comes pre-applied (or requires application) to fill microscopic air gaps between the component and the heat sink. --- ### 3. Thermal Performance Profile The effectiveness of this part depends on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure. | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 1.60 | | **300 (1.5 m/s)** | 1.15 | | **400 (2.0 m/s)** | 0.95 | | **500 (2.5 m/s)** | 0.82 | --- ### 4. Application Use Cases The **ATS-20G-63-C2-R0** is commonly found in: 1. **Networking Hardware:** Switches and routers where high-speed processors generate significant heat. 2. **Industrial PCs:** Compact systems that require reliable passive or semi-active cooling. 3. **Power Supplies:** Cooling voltage regulators or power transistors.