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  • ATS-20G-69-C2-R0

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    The **ATS-20G-69-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance push-pin heat sink line, designed primarily for cooling integrated circuits (ICs) and other electronic components. --- ### Technical Specifications The table below breaks down the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Thermal Resistance** | 11.52°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### Electronic and Thermal Functionality This part serves a critical role in the thermal management of electronic systems. Its design features provide several advantages: #### 1. Thermal Dissipation The "69" in the part number refers to a specific fin pattern and height (20mm). The straight-fin design is optimized for **forced air cooling** environments (fans). It transfers heat from the electronic component (CPU, GPU, or FPGA) into the surrounding air to prevent thermal throttling or component failure. #### 2. Attachment Mechanism: Push-Pin Unlike adhesive-based heat sinks, the **Push-Pin** system: * Provides a **pre-drilled hole pattern** for secure mechanical mounting. * Uses a **compression spring** to ensure consistent downward pressure on the electronic package. * Allows for easy removal and re-application of thermal interface material (TIM) during maintenance. #### 3. Material Compatibility The aluminum 6063 alloy offers high thermal conductivity while remaining lightweight, ensuring that it does not put excessive mechanical stress on the Printed Circuit Board (PCB). --- ### Common Applications * **Networking Equipment:** Routers, switches, and high-speed modems. * **Industrial PCs:** Small form-factor motherboards. * **Embedded Systems:** High-power controllers and processing units.
    ✨ Follow-up Questions
    • ⤷ What are the compatible hole patterns for the ATS-20G-69-C2-R0 push-pins?
    • ⤷ How does the Blue Anodized finish affect the thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used with high-viscosity thermal paste or thermal pads?