The **ATS-20G-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. ### 1. Technical Specifications The part belongs to the **pushPIN™** series, which uses a specific hardware mechanism for secure attachment to a Printed Circuit Board (PCB). | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm x 30mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 26.36°C/W (at 100 LFM) to 5.83°C/W (at 700 LFM) | | **Fin Pattern** | Fine-Pitch (increases surface area) | --- ### 2. Key Components & Design The ATS-20G-79-C2-R0 is engineered for maximum thermal efficiency within a small footprint. * **Fin Profile:** It features a high-density fin structure. This maximizes the surface area contact with the air, allowing for better heat exchange. * **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, this part uses a plastic/brass pin and a stainless steel spring. This ensures constant pressure (interface pressure) between the heat sink and the component, optimizing thermal transfer. * **Thermal Interface Material (TIM):** The part typically comes with a pre-applied thermal pad or "T766" phase-change material on the base, ensuring there are no air gaps between the heat sink and the electronic chip. --- ### 3. Application Use Cases This specific part is used in environments where vertical space is available (30mm height) but horizontal space is limited (25mm width). 1. **Telecommunications:** Cooling small-form-factor networking gear. 2. **Embedded Systems:** Industrial PCs where high-reliability mounting is required. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data The cooling efficiency depends on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :---: | :---: | :---: | :---: | | **Thermal Resistance (°C/W)** | 26.36 | 10.70 | 6.85 | 5.83 |