ATS-20H-06-C2-R0
AI

The **ATS-20H-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, which is engineered for high-velocity airflow environments.
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## 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm |
| **Thermal Resistance** | 2.50 °C/W @ 200 LFM |
| **Fin Style** | Tapered / maxiFLOW™ |
| **Attachment Method** | pushPIN™ (Brass Spring) |
| **Interface Material** | T766 (Thermal Tape) |
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## 2. Key Electronic Features
### A. maxiFLOW™ Fin Geometry
The "tapered fin" design is the standout feature of this component. Unlike standard square fins, the maxiFLOW™ design reduces pressure drop and increases the surface area exposed to the airflow. This is critical for cooling high-density electronic components like CPUs, FPGAs, and ASICs.
### B. pushPIN™ Attachment System
The part uses a **pushPIN™** assembly, which offers several advantages in electronic assembly:
* **Uniform Pressure:** Ensures consistent contact between the heatsink and the semiconductor.
* **Vibration Resistance:** The stainless steel or brass springs provide a secure fit that resists loosening due to mechanical vibration.
* **Ease of Installation:** No tools are typically required for the final snap-in process, reducing labor costs in mass production.
### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T766** thermal tape. This eliminates the need for manual application of thermal grease, ensuring a clean and reliable thermal path from the electronic package to the aluminum sink.
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## 3. Application Use Cases
This heatsink is typically found in the following electronic environments:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PCs and control units.
3. **Power Electronics:** Voltage regulators and high-power LED arrays.
- ⤷
What are the differences between blue anodized and gold anodized heatsinks?
- ⤷ Can this heatsink be used with a custom fan attachment?
- ⤷ What is the specific hole pattern required on the PCB for the pushPIN attachment?