The **ATS-20H-07-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their high-performance "maxiFLOW™" heat sink series. --- ## Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Part Number** | ATS-20H-07-C2-R0 | | **Heat Sink Type** | maxiFLOW™ (Cross-Cut) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 17.00°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ## Component Breakdown ### 1. The maxiFLOW™ Design The "maxiFLOW" geometry features a spread-fin design. Unlike standard extruded heat sinks, these have a tapered fin structure that increases surface area and improves airflow intake. This design is specifically engineered for high-performance cooling in space-constrained environments. ### 2. pushPIN™ Attachment System The suffix **-R0** refers to the specific attachment kit. This model uses a **pushPIN™** system which includes: * **Brass Springs:** Provides a precise, calculated pressure (load) on the electronic component (CPU, GPU, or ASIC) to ensure optimal heat transfer. * **Plastic/Brass Pins:** Secure the heat sink directly to pre-drilled holes in the PCB. ### 3. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** The "C2" in the part number indicates a blue anodized coating. Anodizing provides corrosion resistance and slightly improves radiative heat transfer. ### 4. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a high-performance thermal pad/paste that fills the microscopic air gaps between the heat sink base and the electronic chip, significantly reducing thermal impedance. --- ## Applications This part is typically used to cool: * **BGA (Ball Grid Array) Components:** Such as microprocessors or FPGAs. * **Telecommunications Equipment:** Where high airflow is available but vertical space is limited (12.7mm height). * **Embedded Systems:** Industrial PCs and networking switches.