The **ATS-20H-08-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" product line, designed to provide efficient cooling for electronic components like BGAs (Ball Grid Arrays). --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance (Flow)** | 14.21°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.15°C/W @ 400 LFM | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Design Elements ### A. maxiFLOW™ Geometry The design features a tapered fin structure. Unlike standard square fin heatsinks, the maxiFLOW™ profile increases the surface area and creates turbulence, which maximizes the heat dissipation in environments with low airflow. ### B. pushPIN™ Attachment Instead of using messy thermal adhesives or tapes, this model uses a **pushPIN™** system. - **Mechanism:** A brass or plastic pin with a compressed stainless steel spring. - **Benefit:** It provides a precise, consistent pressure (preload) against the component, ensuring the best possible thermal contact while remaining easy to install or remove for maintenance. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance phase-change material or grease that fills the microscopic air gaps between the heatsink and the chip, significantly reducing thermal resistance. --- ## 3. Application & Use Cases This heatsink is typically found in high-reliability electronic systems where thermal management is critical to prevent component failure. * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial Computers:** Ensuring stability in harsh thermal environments. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **FPGA & GPU Cooling:** Managing heat in logic devices with high power density. --- ## 4. Part Number Breakdown Table If you are sourcing or comparing parts, here is how to read the ATS code: | Component | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **20H** | Series Type (maxiFLOW with pushPIN) | | **08** | Specific Pin/Spring Configuration | | **C2** | Thermal Performance Level / Finish (Blue) | | **R0** | RoHS Compliant / Revision code |