The **ATS-20H-142-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic packages. It belongs to the *maxiFLOW™* series manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimension L x W** | 25.00 mm x 25.00 mm | | **Height (Fin Height)** | 15.00 mm | | **Pitch** | Fine-Pitch | | **Pattern** | Straight-Fin | | **Thermal Resistance** | 10.07°C/W (at 100 LFM) | | **Bore Hole / Distance** | 30.00 mm (between holes) | --- ### 2. Key Electronic Features #### A. Attachment Mechanism: pushPIN™ This part utilizes a "pushPIN" system rather than thermal adhesive. This is critical for electronic stability because: * **Constant Pressure:** It uses a brass component and a stainless steel spring to ensure consistent downward pressure on the chip. * **Reliability:** It prevents the heat sink from shifting during vibration or shipping. * **Pre-assembled:** It comes with the hardware pre-installed to simplify PCB assembly. #### B. Thermal Interface Material (TIM) The part number indicates it typically comes with **T766** thermal material pre-applied to the base. This fills microscopic air gaps between the heat sink and the electronic component (CPU, FPGA, or GPU), significantly improving heat transfer. #### C. Fin Design and Airflow The "Straight-Fin" design is optimized for environments where there is a consistent direction of airflow. The fine-pitch fins increase the surface area available for convection without significantly increasing the footprint on the PCB. --- ### 3. Application Use Cases This heat sink is commonly used in high-density electronic environments such as: 1. **Telecommunications:** Cooling small-form-factor networking chips. 2. **Embedded Systems:** For industrial computers where passive or forced-air cooling is required. 3. **Power Electronics:** Dissipating heat from voltage regulators or motor drivers. ---