The **ATS-20H-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *maxiFLOW™* product line, designed to optimize airflow for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (High Performance) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 41.00mm x 41.00mm x 17.50mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.02°C/W (Unducted Flow @ 200 LFM) | | **Flow Pattern** | maxiFLOW (High Surface Area) | --- ### 2. Key Electronic & Mechanical Parts The assembly consists of more than just the metal block; it includes mechanical interface parts to ensure electronic safety and efficiency. #### A. The Heat Sink Body (maxiFLOW™ Design) The body uses a flared-fin geometry. Unlike standard straight fins, these increase the surface area and minimize pressure drop, which is critical for densely packed electronic PCBs where airflow may be restricted. #### B. The pushPIN™ Attachment This is the mounting mechanism. It typically consists of: * **Brass or Plastic Pins:** To secure the sink to pre-drilled holes in the PCB. * **Compression Springs:** These provide precise "Normal Force" (pressure) onto the electronic chip to ensure optimal thermal contact without cracking the silicon die. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes with a pre-applied **Phase Change Material (PCM)** or a thermal pad on the base. This fills the microscopic air gaps between the chip surface and the aluminum, significantly reducing thermal resistance. --- ### 3. Application in Electronics This component is typically found in: 1. **Telecommunications:** Networking switches and routers. 2. **Power Electronics:** Cooling high-wattage voltage regulators. 3. **Embedded Systems:** Industrial PCs where fan noise must be minimized but heat dissipation is high. --- ### 4. Thermal Performance Data * **@ 200 LFM (Linear Feet per Minute):** 10.02 °C/W * **@ 500 LFM:** 5.33 °C/W * **@ 800 LFM:** 4.23 °C/W *Note: The lower the °C/W value, the more efficient the heat sink is at dissipating energy.*