The **ATS-20H-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 10.00mm | | **Pitch** | Fine Pitch | | **Thermal Resistance** | 12.00°C/W (Unducted @ 100 LFM) | --- ### 2. Key Component Features * **pushPIN™ Attachment:** This is a specialized mounting system that allows for secure, vibration-resistant attachment to the PCB. It uses a spring-loaded mechanism to ensure consistent pressure (TIM compression) on the component being cooled. * **High-Performance Material:** Made from AL6063 aluminum, which provides high thermal conductivity while remaining lightweight. * **Pre-assembled Thermal Interface Material (TIM):** Most "C2" series parts come with a pre-applied high-performance thermal pad or grease (typically ATS-PPS-02) to ensure efficient heat transfer from the chip to the heatsink. * **Blue Anodized Finish:** The anodized coating protects the aluminum from corrosion and slightly increases emissivity, which helps with radiant heat transfer. --- ### 3. Thermal Performance Comparison Thermal performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.00 | | 300 (1.5 m/s) | 4.20 | | 500 (2.5 m/s) | 2.90 | | 700 (3.5 m/s) | 2.30 | --- ### 4. Typical Applications This specific heatsink is ideal for: * **CPUs/GPUs:** Low-profile cooling for embedded processors. * **Telecommunications:** Cooling of high-speed data chips. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Industrial Controls:** Where vibration resistance (via pushPIN) is required.