The **ATS-20H-72-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" product line, designed to optimize airflow and thermal management for electronic components like BGA (Ball Grid Array) chips. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Type** | Heatsink (Push-Pin Attachment) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance (Flowing Air)** | 2.51 °C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 5.07 °C/W | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 15.00 mm | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | --- ## Breakdown of Part Components ### 1. Thermal Performance & Geometry The "72" series features the **maxiFLOW™** design. Unlike standard square fin heatsinks, this design uses a tapered fin structure. This increases the surface area for heat dissipation while reducing the pressure drop, allowing air to move through the fins more efficiently. ### 2. Attachment Mechanism (Push-Pin) This part utilizes a **Push-Pin and Spring** assembly. * **Purpose:** Ensures a constant and uniform pressure (Pre-load) on the electronic component (CPU, FPGA, or GPU). * **Reliability:** It is more secure than thermal adhesive tapes, making it suitable for high-vibration environments. * **Hole Pattern:** Requires specific pre-drilled holes in the PCB. ### 3. Thermal Interface Material (TIM) The **C2** designation usually indicates that the heatsink comes pre-applied with a high-performance thermal interface material (like a thermal pad or phase-change material). This fills the microscopic air gaps between the component and the heatsink base to maximize heat transfer. ### 4. Material and Finish * **Aluminum:** Chosen for its excellent weight-to-thermal conductivity ratio. * **Blue Anodized:** The coating protects the aluminum from corrosion and slightly increases emissivity (radiation heat transfer). --- ## Typical Applications * **Networking Gear:** Switches and routers where high airflow is present. * **Industrial PCs:** Where components are subject to mechanical stress. * **Power Supplies:** Cooling MOSFETs or large integrated circuits. ---