The **ATS-20H-91-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" thermal management series, designed to cool electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance (Unducted)** | 21.97 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Fin Pattern** | Fine Pitch (Straight Fin) | | **RoHS Status** | Compliant | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **20**: The specific family/series of the pushPIN™ attachment. * **H**: High performance / Fin density designation. * **91**: Specific geometry/fin configuration code. * **C2**: Material and Finish code (typically Blue Anodized Aluminum). * **R0**: Revision or packaging designator. --- ### 3. Key Features * **pushPIN™ Attachment:** This part uses a specialized attachment system consisting of a brass or plastic pin and a stainless steel spring. This ensures a consistent pressure (Force) against the component for optimal heat transfer. * **Pre-Applied Thermal Interface Material (TIM):** Most "R0" variants come with a pre-applied thermal pad or phase-change material on the base, simplifying assembly. * **Vertical Fin Design:** The straight-fin design is optimized for airflow environments, allowing air to pass through the gaps and carry heat away from the base. --- ### 4. Application Use Cases This component is typically used in: 1. **Telecommunications:** Cooling ASICs and FPGAs in networking switches. 2. **Embedded Systems:** Industrial PCs where space is constrained but thermal loads are high. 3. **Power Electronics:** Dissipating heat from high-speed transistors or power modules.