The **ATS-20H-95-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. ### 1. Key Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 7.29 °C/W (at 200 LFM) | | **Fin Pattern** | High-performance Cross-Cut | --- ### 2. Physical Design and Features * **Cross-Cut Fin Design:** The fins are cut in both directions. This increases surface area and creates more turbulence in the airflow, which significantly improves heat dissipation compared to straight-fin designs. * **Push Pin Attachment:** It uses two brass push pins with a specialized spring mechanism. This ensures consistent pressure on the electronic component (TIM - Thermal Interface Material), optimizing heat transfer and preventing the sink from shifting during vibration. * **Material Choice:** Made of lightweight aluminum with a blue anodized finish. Anodizing provides a thin layer of insulation and increases the emissivity of the surface, further aiding radiant cooling. ### 3. Electronic Application The ATS-20H-95-C2-R0 is typically used in the following electronic environments: 1. **High-Density PCBs:** Because of its compact 40mm footprint, it fits well on crowded boards. 2. **Network Hardware:** Used on switches and routers for cooling ASICs (Application-Specific Integrated Circuits). 3. **Power Electronics:** Applied to MOSFETs or voltage regulators that generate significant heat during high current draw. 4. **Embedded Systems:** Ideal for industrial PCs where active fan cooling may be limited, relying instead on ambient airflow. --- ### 4. Thermal Performance Comparison Thermal resistance ($\theta$) is measured in °C/W. A lower number indicates better performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 7.29 | | 400 (2.0 m/s) | 4.24 | | 600 (3.0 m/s) | 3.35 |