The **ATS-20H-99-C2-R0** is a high-performance electronic component specifically designed for **Thermal Management**. It is a specialized heat sink manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | Model series: pushPIN™ | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Dimension (Base)** | 45mm x 45mm | Square footprint for standard BGAs | | **Height** | 20mm | Low profile for vertical space constraints | | **Attachment Type** | pushPIN™ | Spring-loaded pins for secure mounting | | **Thermal Resistance** | ~11.5 °C/W (Unducted) | Varies based on airflow (LFM) | | **Finish** | Blue Anodized | Increases surface area and prevents oxidation | --- ### 2. Key Features & Components * **Fin Design (Cross-Cut):** The "99" in the part number indicates a specific fin pattern. Cross-cut fins allow for multi-directional airflow, making it efficient in systems where air direction might change. * **Attachment Mechanism:** It uses a **pushPIN™** system which consists of a brass or plastic pin and a high-performance compression spring. This ensures consistent pressure (TIM compression) and vibration resistance. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or similar, ensuring immediate thermal contact between the component (CPU/GPU) and the heat sink. --- ### 3. Application Use Cases The ATS-20H-99-C2-R0 is commonly used in electronic assemblies where power density is high but space is limited: 1. **Telecommunications:** Cooling for high-speed network switches and routers. 2. **Embedded Computing:** Thermal management for industrial motherboards. 3. **Power Supplies:** Dissipating heat from MOSFETs and voltage regulators. --- ### 4. Thermal Performance Data Performance is highly dependent on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.5 | | 200 (1.0 m/s) | 4.0 | | 500 (2.5 m/s) | 1.7 | ---