The **ATS-21B-07-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ice" or high-efficiency push-pin series designed for cooling integrated circuits (ICs) and other electronic surface-mount components. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing)** | 16.97 °C/W (@ 100 LFM) | | **Thermal Resistance (Static)** | 3.90 °C/W | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Height Off Base)** | 12.7mm | | **Attachment Method** | Push-Pin (Spring Loaded) | --- ### 2. Key Components & Design The "Electronic Part" functionality of this device is purely **passive thermal management**. Its effectiveness is derived from three main structural elements: 1. **Heat Sink Body (The Fin Array):** * Constructed from high-grade aluminum. * Uses a specialized fin pattern to maximize surface area for heat dissipation without significantly blocking airflow. 2. **Push-Pin Attachment:** * The "R0" suffix often indicates the specific hardware kit. It uses plastic or brass push-pins with a compression spring. * This ensures consistent **interface pressure** between the heat sink and the chip, which is critical for heat transfer efficiency. 3. **Thermal Interface Material (TIM):** * Typically comes pre-applied with a high-performance Phase Change Material (PCM) or thermal pad on the base to fill microscopic air gaps between the component and the sink. --- ### 3. Application Use Cases This specific part is generally found in electronic assemblies where high-speed processing generates significant localized heat: * **Network Switches/Routers:** Cooling ASICs and FPGA chips. * **Industrial Power Supplies:** Cooling MOSFETs or power regulators. * **Embedded Systems:** Used on SoCs (System on Chips) that require active or passive cooling within a chassis. --- ### 4. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying variations: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **21B:** Product Series/Type. * **07:** Specific dimension/fin configuration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or Packaging code (often denotes standard push-pin hardware).