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  • ATS-21B-182-C2-R0

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    The **ATS-21B-182-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink. | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-21B-182-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.51°C/W (Unducted Flow @ 200 LFM) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Type** | Straight Fin | | **Weight** | ~25 grams | --- ### 2. Design Characteristics This component belongs to the **pushPIN™** series, which is characterized by a specific mounting system rather than simple adhesive tapes. * **Heat Sink Profile:** The "182" in the part number indicates a specific fin density and height (15mm). It is a low-to-medium profile heat sink suitable for compact enclosures. * **Material:** Made of high-grade aluminum for a balance between weight, cost, and thermal conductivity. * **Coating (C2):** The "C2" suffix indicates the thermal interface material (TIM) or finish. In this case, it usually refers to a **Blue Anodized** finish, which protects the aluminum from corrosion and slightly increases emissivity. * **Attachment:** Uses the **pushPIN™** mechanism with a brass or plastic pin and a stainless steel spring. This provides consistent pressure on the electronic component (IC), ensuring optimal thermal contact. --- ### 3. Electronic Application This part is typically used on the following electronic components: 1. **Processors:** Small CPUs or SoCs (System on Chips) in networking equipment. 2. **ASICs/FPGAs:** Custom logic chips that generate significant heat during high-speed data processing. 3. **Power Electronics:** Voltage regulators or motor drivers that require passive cooling. --- ### 4. Dimensional Diagram (Approximate) ```text [ 40.00 mm ] _________________ | ||||||||||||||| | | ||||||||||||||| | <-- Straight Fins | ||||||||||||||| | |_________________| [ 40.00 mm ] | | [ 15.00 mm Height ] ```
    ✨ Follow-up Questions
    • ⤷ How does the pushPIN™ attachment compare to thermal adhesive tape?
    • ⤷ What is the importance of the Blue Anodized finish in thermal management?
    • ⤷ How do I calculate if the 7.51°C/W thermal resistance is sufficient for my chip?