ATS-21B-182-C2-R0
AI

The **ATS-21B-182-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink.
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-21B-182-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 7.51°C/W (Unducted Flow @ 200 LFM) |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 40mm x 40mm x 15mm |
| **Fin Type** | Straight Fin |
| **Weight** | ~25 grams |
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### 2. Design Characteristics
This component belongs to the **pushPIN™** series, which is characterized by a specific mounting system rather than simple adhesive tapes.
* **Heat Sink Profile:** The "182" in the part number indicates a specific fin density and height (15mm). It is a low-to-medium profile heat sink suitable for compact enclosures.
* **Material:** Made of high-grade aluminum for a balance between weight, cost, and thermal conductivity.
* **Coating (C2):** The "C2" suffix indicates the thermal interface material (TIM) or finish. In this case, it usually refers to a **Blue Anodized** finish, which protects the aluminum from corrosion and slightly increases emissivity.
* **Attachment:** Uses the **pushPIN™** mechanism with a brass or plastic pin and a stainless steel spring. This provides consistent pressure on the electronic component (IC), ensuring optimal thermal contact.
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### 3. Electronic Application
This part is typically used on the following electronic components:
1. **Processors:** Small CPUs or SoCs (System on Chips) in networking equipment.
2. **ASICs/FPGAs:** Custom logic chips that generate significant heat during high-speed data processing.
3. **Power Electronics:** Voltage regulators or motor drivers that require passive cooling.
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### 4. Dimensional Diagram (Approximate)
```text
[ 40.00 mm ]
_________________
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| ||||||||||||||| | <-- Straight Fins
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|_________________| [ 40.00 mm ]
| |
[ 15.00 mm Height ]
```
- ⤷
How does the pushPIN™ attachment compare to thermal adhesive tape?
- ⤷ What is the importance of the Blue Anodized finish in thermal management?
- ⤷ How do I calculate if the 7.51°C/W thermal resistance is sufficient for my chip?