The **ATS-21B-76-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic packages. --- ## 1. Technical Specifications The part number encodes specific data regarding its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 40mm x 15mm | | **Thermal Resistance** | 11.57°C/W (at 1.0 m/s airflow) | --- ## 2. Key Features ### A. Thermal Design The "maxiFLOW" design features a flared fin structure. This increases the surface area for heat dissipation while maintaining a low pressure drop, making it highly efficient in environments with forced-air cooling (fans). ### B. Attachment Mechanism (pushPIN™) The part utilizes the **pushPIN™** system, which includes: * A flexible, stainless steel spring that applies precise pressure to the component. * Plastic or brass pins that lock into pre-drilled holes on the Printed Circuit Board (PCB). * Standardized hole patterns to ensure compatibility and ease of installation. ### C. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides corrosion resistance and increases thermal emissivity, helping with radiant heat loss. --- ## 3. Application Use Cases This specific heat sink is typically used for cooling: 1. **Processors (CPUs/GPUs):** Low-profile cooling for embedded systems. 2. **FPGAs and ASICs:** High-speed logic chips that generate significant heat in telecommunications equipment. 3. **Power Supplies:** Cooling voltage regulators or power transistors. --- ## 4. Nomenclature Breakdown `ATS - 21 B - 76 - C2 - R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **21:** Series/Family identification. * **B:** Specific physical variation/footprint. * **76:** Height or specific dimensional code. * **C2:** Material/Thermal Interface Material (TIM) configuration (usually indicates T766 phase change material or similar). * **R0:** Revision code or RoHS compliance indicator.