The **ATS-21B-83-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic devices like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Thermal Resistance (Flowing)** | 1.60°C/W @ 200 LFM | | **Thermal Resistance (Static)** | 4.70°C/W (Unducted) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features #### A. maxiFLOW™ Geometry The "B" in the part number refers to the specialized fin profile. Unlike standard straight fins, maxiFLOW™ heat sinks feature a **tapered fin design** that maximizes the surface area for radiant cooling while increasing air turbulence, which significantly improves thermal efficiency. #### B. pushPIN™ Attachment System The component utilizes the **pushPIN™** mounting mechanism. This is a spring-loaded fastener system that ensures: * **Constant Pressure:** Maintains optimal contact between the heat sink and the electronic chip. * **Ease of Assembly:** Can be installed manually or with basic tools into pre-drilled PCB holes. * **Reliability:** Resistant to shock and vibration compared to adhesive-based solutions. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance thermal grease/pad that fills microscopic air gaps between the heat sink and the component, ensuring maximum heat transfer. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips and routers. 2. **Embedded Systems:** Industrial PCs where space is limited but vertical clearance allows for a 30mm height. 3. **Power Electronics:** Managing heat for voltage regulators and power converters.