The **ATS-21B-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount devices (SMDs). --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Dimensions** | 40mm x 40mm | | **Height** | 10mm (Low Profile) | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 24.00°C/W (at 100 LFM) to 4.40°C/W (at 700 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Component Breakdown #### A. The pushPIN™ Attachment System The "21B" in the part number signifies the specific push-pin attachment mechanism. This system provides: * **Constant Pressure:** A pre-assembled spring ensures consistent pressure across the component surface, optimizing thermal transfer. * **Secure Mounting:** Requires pre-drilled holes in the PCB, preventing the heat sink from shifting during vibration or mechanical shock. #### B. Thermal Interface Material (TIM) This specific model (indicated by the suffix **C2**) comes with **T766** thermal grease pre-applied. * **Purpose:** To fill microscopic air gaps between the heat sink base and the electronic component (CPU/GPU/FPGA). * **Advantage:** Reduces assembly time and ensures a high-quality thermal bond right out of the box. #### C. Material and Coating * **Aluminum Construction:** Offers a balance of lightweight design and high thermal conductivity. * **Blue Anodized Finish:** The "R0" designation typically refers to the finish. Anodizing increases corrosion resistance and provides a small boost to radiant heat dissipation. --- ### 3. Application Use Cases This part is commonly used in the following electronic systems: 1. **Telecommunications:** Cooling networking chips in switches and routers. 2. **Embedded Systems:** High-performance ARM or FPGA processors in industrial controllers. 3. **Power Electronics:** Managing heat in MOSFET arrays or power conversion modules. --- ### 4. Thermal Performance Comparison (Airflow) The efficiency of this part is highly dependent on the velocity of the air (Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 24.00 | | 300 (Low Fan) | 8.80 | | 500 (Medium Fan) | 5.50 | | 700 (High Fan) | 4.40 |