The **ATS-21B-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to optimize airflow and heat dissipation for high-heat electronic components. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 21.97 °C/W (at 100 LFM) | | **Flow Pattern** | maxiFLOW (Directional) | | **Spring/Pin Type** | Brass Pin / Steel Spring | --- ### 2. Key Components & Design Features #### A. The Fin Geometry (maxiFLOW™) The "91" in the part number refers to a specific fin profile. These heat sinks feature a **tapered fin design** that reduces pressure drop and increases the surface area for heat transfer. This makes them highly effective in constrained airflow environments. #### B. The pushPIN™ Attachment System This part uses a specialized mechanical attachment system: * **Compression Springs:** Provide the precise amount of force required to maintain contact between the heat sink and the chip. * **Plastic/Brass Pins:** Secure the unit through pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The **"R0"** suffix typically indicates that the part comes pre-applied with a high-performance thermal interface material (like Chomerics T766). This eliminates the need for manual application of thermal paste during assembly. --- ### 3. Electronic Application Use-Cases This heat sink is typically used to cool the following types of electronic components: 1. **BGA Packages:** Ball Grid Array chips such as CPUs or small GPUs. 2. **FPGAs:** Field Programmable Gate Arrays that generate significant heat during high-speed processing. 3. **ASICs:** Application-Specific Integrated Circuits found in networking hardware and telecommunications equipment. --- ### 4. Part Number Breakdown (Nomenclature) `ATS - 21 B - 91 - C2 - R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **21:** Series number (Physical footprint). * **B:** Attachment style (pushPIN). * **91:** Specific fin height and density configuration. * **C2:** Material/Finish (Blue Anodized Aluminum). * **R0:** Thermal Interface Material / Packaging variant.