The **ATS-21D-01-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-velocity airflow environments. --- ### Technical Specifications | Feature | Details | | :--- | :--- | | **Part Number** | ATS-21D-01-C2-R0 | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ | | **Dimensions** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 21.93°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Spread Fin (Optimized for airflow) | | **Compliance** | RoHS and REACH Compliant | --- ### Key Components & Features #### 1. Heat Sink Body The body is made of **Aluminum**, chosen for its high thermal conductivity and lightweight properties. The "C2" in the part number indicates a **Blue Anodized** finish, which increases surface emissivity and provides corrosion resistance. #### 2. pushPIN™ Attachment System Unlike adhesive tapes, this part uses a mechanical **pushPIN™** system. * **Springs:** Provides a precise, pre-calculated pressure to ensure optimal thermal interface material (TIM) contact. * **Installation:** Requires pre-drilled holes in the PCB. #### 3. maxiFLOW™ Fin Design The fins are designed with a specific "spread" geometry. This reduces pressure drop and allows air to move more freely across the surface, making it highly efficient in forced-convection (fan-cooled) systems. #### 4. Thermal Interface Material (TIM) The "R0" suffix typically denotes the inclusion of a pre-applied high-performance thermal pad or grease, ensuring there are no air gaps between the electronic component (CPU/GPU/FPGA) and the heat sink. --- ### Typical Applications This specific heat sink is used to cool integrated circuits that generate moderate heat in constrained spaces, such as: * **Network Switches/Routers** * **Telecommunications equipment** * **Industrial Power Supplies** * **Embedded Computing Boards** ---