The **ATS-21D-129-C2-R0** is a high-performance electronic component specifically designed for thermal management. It is a **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**, belonging to their "pushPIN™" series. --- ## Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Part Number** | ATS-21D-129-C2-R0 | Standard Product Identifier | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Enhances surface durability and emissivity | | **Attachment Type** | pushPIN™ | Uses a spring-loaded mechanism for secure mounting | | **Thermal Resistance** | 8.68°C/W (Unducted) | Measures cooling efficiency at 100 LFM | | **Dimensions** | 54.00 x 54.00 x 10.00 mm | Large surface area with low profile (10mm height) | | **Thermal Interface** | T766 | High-performance pre-applied thermal phase change material | --- ## Key Components and Design Features ### 1. Fin Configuration (Fine Pitch) The heatsink features a **Fine Pitch** design with a **Square** pattern. This maximizes the surface area within a small footprint, making it ideal for high-density electronic assemblies where airflow might be constrained but high cooling performance is required. ### 2. pushPIN™ Attachment System Instead of using messy adhesives or fragile clips, this part uses the ATS pushPIN™ system. * **Springs:** Provides consistent pressure (force) to ensure a tight bond between the heatsink and the heat source. * **Hardware:** Typically includes brass or plastic bolts that snap into pre-drilled holes on the PCB. ### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766 thermal grease/pad**. This is a high-quality material pre-applied to the base of the heatsink to eliminate air gaps between the semiconductor (CPU/GPU/FPGA) and the metal, significantly improving heat transfer. --- ## Common Applications Because of its low profile (10mm height) and high efficiency, this part is commonly used in: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Computing:** Secondary cooling for chipsets or FPGAs on a motherboard.