The **ATS-21D-161-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Type** | Top-mount Heat Sink | | **Attachment Method** | Push-Pin (2-piece) | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.15°C/W (at 200 LFM) | | **Dimensions** | 45mm x 45mm x 20mm | --- ## 2. Component Breakdown ### A. Material and Coating * **Aluminum Construction:** Aluminum is used because it provides a high thermal conductivity-to-weight ratio, ensuring efficient heat transfer while remaining lightweight. * **Blue Anodized Finish:** The anodization protects the aluminum from corrosion and slightly improves surface emissivity for better radiation cooling. ### B. Attachment Mechanism (pushPIN™) The "R0" at the end of the part number indicates the specific mounting hardware. This model uses a **push-pin** system with a compression spring. * **Ease of Assembly:** It allows for quick installation on a PCB without complex tools. * **Constant Pressure:** The spring ensures that the heat sink maintains firm, uniform contact with the electronic chip, which is critical for minimizing thermal interface resistance. ### C. Fin Geometry * **Cross-Cut Fins:** Unlike straight fins, cross-cut designs create a more turbulent airflow. This helps break up the "boundary layer" of air, significantly increasing the cooling efficiency in forced-air environments (systems with fans). --- ## 3. Thermal Performance Data Performance is measured by **Thermal Resistance (°C/W)**. A lower value indicates better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 100 LFM (0.5 m/s) | 4.74 °C/W | | 200 LFM (1.0 m/s) | 2.57 °C/W | | 400 LFM (2.0 m/s) | 1.90 °C/W | | 600 LFM (3.0 m/s) | 1.63 °C/W | --- ## 4. Applications This specific part is typically found in: * **Network Switches/Routers:** Cooling high-speed processors. * **Power Supplies:** Managing heat for voltage regulators. * **Industrial PCs:** Ensuring stability in high-temperature environments. * **Embedded Systems:** Where space is limited but high TDP (Thermal Design Power) must be managed.