The **ATS-21D-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by Advanced Thermal Solutions, Inc. (ATS). --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.30°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 25.00 mm x 25.00 mm | | **Height (Fin)** | 15.00 mm | | **Hole Pattern** | 20.00 mm x 20.00 mm | --- ## 2. Key Electronic Components & Features ### A. pushPIN™ Attachment System Unlike traditional adhesive-based heatsinks, this model uses the **pushPIN™** system. This consists of: * **Compression Springs:** Provides precise pressure to ensure optimal thermal interface contact. * **Brass/Plastic Pins:** Securely locks the heatsink into pre-drilled holes on the PCB, preventing movement during vibration or shipping. ### B. Fin Design (High Performance) The "166" series typically features a **Straight Fin** or **Cross-Cut** geometry. This allows for: * **Bi-directional Airflow:** It can dissipate heat effectively regardless of which direction the cooling fan is blowing. * **Low Pressure Drop:** The spacing between fins is optimized to allow air to pass through without requiring high-static pressure fans. ### C. Thermal Interface Material (TIM) The **C3** designation in the part number indicates that the heatsink comes pre-applied with **T766 Phase Change Material** (or similar high-performance grease). This ensures there are no microscopic air gaps between the chip and the aluminum, maximizing heat transfer. --- ## 3. Applications in Electronics This specific size (25mm x 25mm) is commonly used for: 1. **Network Switches:** Cooling Small Form-factor Pluggable (SFP) modules or small processors. 2. **Embedded Systems:** Cooling SoCs (System on a Chip) in industrial computers. 3. **Power Supplies:** Managing heat for MOSFETs or voltage regulators. --- ## 4. Ordering & Variant Code Breakdown ```text ATS-21D-166-C3-R0 | | | | | | | | | +-- Revision/Color (Blue Anodized) | | | +----- Thermal Interface Material (T766) | | +--------- Fin Profile/Height Identifier | +------------ Thermal resistance/Performance Class +--------------- Manufacturer Prefix ```