The **ATS-21D-18-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to optimize airflow and cooling for electronic components like BGAs (Ball Grid Arrays). --- ### 1. Technical Specifications The following table highlights the primary mechanical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-21D-18-C2-R0 | | **Thermal Resistance** | 4.45°C/W (at 200 LFM) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 35mm x 35mm x 15mm | --- ### 2. Key Electronic Components & Design The "parts" of this component aren't electronic circuits, but rather mechanical features designed to protect electronic chips: * **Heat Sink Base (35x35mm):** The flat bottom surface that makes contact with the heat-generating component (CPU, GPU, or FPGA). * **maxiFLOW™ Fin Pattern:** The fins are designed with a tapered gradient. This reduces pressure drop and increases the surface area, allowing more air to pass through and carry away heat efficiently. * **pushPIN™ Attachment:** Instead of messy adhesives, this part uses a mechanical spring-loaded pin system. This ensures even pressure across the chip surface for optimal thermal transfer. * **Thermal Interface Material (TIM):** This part usually comes with **T766** pre-applied or recommended, which is a phase-change material that fills microscopic air gaps between the chip and the metal. --- ### 3. Application Use Cases This component is typically used in environments where heat dissipation is critical for electronic longevity: 1. **Telecommunications:** Cooling high-speed processing chips in routers and switches. 2. **Embedded Systems:** Protecting industrial PCs and controllers. 3. **Power Electronics:** Managing heat for voltage regulators or power modules. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **21:** Series number (maxiFLOW design) * **D:** Performance/Fin Density variation * **18:** Dimensional/Design code * **C2:** Blue Anodized finish * **R0:** Revision/Packaging code